Abstract:Agglomerated grains of diamond bonded with Cu-P alloy powder have prepared at varies sintered temperature. Differential thermal analysis (DTA) and X-ray diffraction (XRD) are used to test the melting characteristics and phase composition of the Cu-P alloy. Scanning electron microscope (SEM) is used to analyze the microstructure of the agglomerated grains of diamond, the wettability of diamond and bond interface. The physical properties such as single particle compressive strength, impact toughness (TI), porosity and average pore size of the agglomerated grains of diamond are tested. Meanwhile, the grinding performance of the agglomerated grains of diamond prepared at varies sintering temperature is compared, and the grinding mechanism of the agglomerated grains of diamond is explained. Results indicate that for agglomerated grains of diamond sintered at 760℃, the diamond is well wrapped by Cu-P bond with a good wettability and an appropriate protrusion height. The agglomerated grains of diamond have excellent mechanical properties. Its single particle compressive strength, impact toughness, porosity and average pore size are 23N, 78%, 29.33% and 18.53um, respectively. The agglomerated grains of diamond sintered at 760℃ show the best grinding performance. After grinding, the agglomerated grains of diamond in the grinding wheel are in a semi-wear state. Moreover, the grinding ratio to zirconia ceramics is 24.8, and the surface roughness is 1.01μm.