Amorphous Ni-P and Ni-Sn-P coatings were prepared on pure copper substrates by electroless plating. The structure, surface morphology and composition of the as-plated coatings were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM) and energy-dispersive analysis (EDS). The corrosion resistance behaviors of the as-plated Ni-P and Ni-Sn-P coatings were investigated by Tafel polarization, electrochemical impedance spectroscopy (EIS), open circuit potential and accelerating corrosion indoors in wNaCl=3.5% solution at pH 5.5 and in soil with a water content of wS=20% at pH 5.5. The results indicate that electroless amorphous Ni-P and Ni-Sn-p plating of the corrosion current density is 4.5% and 1.2% of the bare copper and the two coatings offer better corrosion resistance than copper in weak acidic corrosive medium, while Ni-Sn-P coating exhibits the best corrosion resistance. Besides, the two coatings have a negative shift of self-corrosion potential when compared with Cu substrate, showing a good application prospect as anodic protective coatings for Cu ground wires in acidic or weak acidic soil medium.