LIU Yunchao1,2, CHEN Min1, LIU Yuntao3, XIAO Jingbo1, ZHANG Chengbin1, CHEN Jie1
(1.Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China;2.University of Chinese Academy of Sciences, Beijing 100049, China;3.College of Information and Communication Engineering, Harbin Engineering University, Harbin 150001, China)