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Bond Performances between Asphalt Surface and UHPC of Ultra-High Performance Lightweight Composite Decks
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    Abstract:

    It is important to guarantee strong bonding between UHPC and asphalt surface to prolong the service life and avoid the diseases of the bridge deck,such as slippage and delamination. Finite element analysis and laboratory tests were conducted to investigate the influences of kinds of binders and ambient temperatures on bonding performances. The test results showed that the ambient temperature had a great effect on the interface strength by shear and pull-off tests of composite specimens. Compared with normal temperature (20℃),the interface bonding performances had been decreased greatly at high temperature(60℃). Epoxy binders named KD-HYP and 202 exhibited better bonding ability than epoxy asphalt,Shell HV and rubber asphalt. Although epoxy asphalt had higher bonding strength than Shell HV and rubber asphalt at high temperature,but there were no obvious differences among them at normal temperature. The finite element simulation of the second Dongting Lake Bridge showed that the maximum shear stress between UHPC-SMA was 0.696MPa and 0.422MPa respectively at 20℃(normal temperature) and 60℃(high temperature),and the maximum tensile stress was 0.167MPa and 0.152MPa respectively. The researches indicate that,under the most unfavorable load combinations consisting of overload,braking hardly and dynamic loads,KD-HYP and 202 can meet the requirements of interface bonding stresses,and are of sufficient safety at normal temperature and high temperature. But Shell HV,rubber asphalt and epoxy asphalt cannot do at high temperature.

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  • Received:
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  • Online: May 17,2019
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