Aiming at the problem of difficult machining of micro-structured surfaces of super-hard materials such as sapphire， a microstructure technology for grinding surfaces based on structured grinding wheels is proposed. In this paper， the surface of the grinding wheel is structured through Wire Electrical Discharge Machining（WEDM） technology， and the structurally dressed wheel was utilized to grind the microstructure of the sapphire surface. The influence law of structured wheel grinding speed， grinding depth， and feed rate on the surface roughness at the bottom of sapphire microgrooves in both down and up grinding modes was carried out. The results show that the microgroove morphology of the sapphire surface ground by the structured wheel is basically complete， the dimensional error is only 1.4 μm relative to the cutting depth of 120 μm， and the perpendicularity of the microgrooves is better， with a perpendicularity deviation of only 4.9°； The surface roughness at the bottom of the sapphire microgroove can be reduced by increasing the grinding speed and decreasing the grinding depth and feed rate in both down and up grinding modes； Compared with the up-grinding method， the micro-pits on the bottom surface of the micro-groove are smaller， and the bottom surface quality is better in the down-grinding method. The bottom surface roughness is reduced from 4.487 μm to 2.923 μm under the better machining parameters of grinding speed of 35 m/s， grinding depth of 1 μm， and workpiece feed speed of 200 mm/min.